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UC1843A-EP - Current-Mode PWM Controllers

Download the UC1843A-EP datasheet PDF. This datasheet also covers the UC1842A-EP variant, as both devices belong to the same current-mode pwm controllers family and are provided as variant models within a single manufacturer datasheet.

General Description

The UC1842A/3A/4A/5A family of control ICs is a pin-for-pin compatible improved version of the UC3842/3/4/5 family.

Key Features

  • to control current mode switched mode power supplies, this family has the following improved features. Start up current is guaranteed to be less than 0.5 mA. Oscillator discharge is trimmed to 8.3 mA. During under voltage lockout, the output stage can sink at least 10 mA at less than 1.2 V for VCC over 5 V. The difference between members of this family are shown in the table below. PART NUMBER UC1842A UC1843A UC1844A UC1845A UVLO ON 16 V 8.5 V 16 V 8.5 V UVLO OFF 10 V 7.9 V 10 V 7.9 V MAXIMU.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (UC1842A-EP-etcTI.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP CURRENT-MODE PWM CONTROLLER D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Extended Temperature Performance of −55°C to 125°C D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product Change Notification D Qualification Pedigree† D Optimized for Off-line and DC-to-DC Converters D Low Start Up Current (<0.5 mA) D Trimmed Oscillator Discharge Current † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.